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      i3_mega-x-pic


      Modular Design
      No assembly hassle, get started quickly.

      Ultrabase Platform
      Strong adhesion, easy removal, repeatedly used without sacrificing performance.

       

       

      Powerful Extruder
      Provides better printing experience, compatible with TPU

      Effortless Leveling
      A big leveling knob is much more convenient to grip, significantly saves you effort.

            

      PLEASE NOTE:

      Customers need to know that no matter with free shipping or not, it does not include your country's import tax or clearance costs.
      Please check carefully with your local custom before placing order.

      When you place the order, ​please kindly leave us a message about what specification of power and plug you need.

             

      Technical Specifications

      • Printing Technology: FDM (Fused Deposition Modeling)
      • Layer Resolution: 0.05-0.3 mm
      • Positioning Accuracy: X/Y 0.0125mm Z 0.002mm
      • Supported Print Materials: PLA, TPU, HIPS, Wood, PETG
      • Print Speed: 20~100mm/s(suggested 60mm/s)
      • Nozzle Diameter: 0.4 mm
      • Build Size: 300 x 300 x 305mm
      • Operational Extruder Temperature: Max 250ºC
      • Operational Print Bed Temperature: Max 90ºC
      • Printer Dimensions: 500mm x 500mm x553mm
      • Input Formats: .STL, .OBJ, .DAE, .AMF
      • Ambient Operating Temperature: 8ºC - 40ºC
      • Connectivity: SD Card, Data cable (expert users only)
      • Filament Sensor: Yes
      • Net Weight: ~19kg 
         
       

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